Transactions on Cryptographic Hardware and Embedded Systems, Volume 2022
Verified NTT Multiplications for NISTPQC KEM Lattice Finalists: Kyber, Saber, and NTRU
Vincent Hwang
Academia Sinica and National Taiwan University
Jiaxiang Liu
Shenzhen University
Gregor Seiler
IBM Research Zurich
Xiaomu Shi
Shenzhen University
Ming-Hsien Tsai
National Applied Research Labs
Bow-Yaw Wang
Academia Sinica
Bo-Yin Yang
Academia Sinica
Keywords: NIST PQC, NTT, Verification, NTRU, Kyber, Saber
Abstract
Postquantum cryptography requires a different set of arithmetic routines from traditional public-key cryptography such as elliptic curves. In particular, in each of the lattice-based NISTPQC Key Establishment finalists, every state-ofthe-art optimized implementation for lattice-based schemes still in the NISTPQC round 3 currently uses a different complex multiplication based on the Number Theoretic Transform. We verify the NTT-based multiplications used in NTRU, Kyber, and SABER for both the AVX2 implementation for Intel CPUs and for the pqm4 implementation for the ARM Cortex M4 using the tool CryptoLine. e extended CryptoLine and as a result are able to verify that in six instances multiplications are correct including range properties.
We demonstrate the feasibility for a programmer to verify his or her high-speed assembly code for PQC, as well as to verify someone else’s high-speed PQC software in assembly code, with some cooperation from the programmer.
Publication
Transactions of Cryptographic Hardware and Embedded Systems, Volume 2022, Issue 4
PaperArtifact
Artifact number
tches/2022/a20
Artifact published
October 31, 2022
Note that license information is supplied by the authors and has not been confirmed by the IACR.
BibTeX How to cite
Hwang, V., Liu, J., Seiler, G., Shi, X., Tsai, M.-H., Wang, B.-Y., & Yang, B.-Y. (2022). Verified NTT Multiplications for NISTPQC KEM Lattice Finalists: Kyber, SABER, and NTRU. IACR Transactions on Cryptographic Hardware and Embedded Systems, 2022(4), 718–750. https://doi.org/10.46586/tches.v2022.i4.718-750. Artifact available at https://artifacts.iacr.org/tches/2022/a20