Transactions on Cryptographic Hardware and Embedded Systems, Volume 2024
Time Sharing - A Novel Approach to Low-Latency Masking
Dilip Kumar S. V.
COSIC, ESAT, KU Leuven, Leuven, Belgium
Siemen Dhooghe
COSIC, ESAT, KU Leuven, Leuven, Belgium
Josep Balasch
e-Media Research Lab, STADIUS, KU Leuven, Leuven, Belgium
Benedikt Gierlichs
COSIC, ESAT, KU Leuven, Leuven, Belgium
Ingrid Verbauwhede
COSIC, ESAT, KU Leuven, Leuven, Belgium
Keywords: Hardware, Masking, Probing Security, Side-Channel Analysis
Abstract
We present a novel approach to small area and low-latency first-order masking in hardware. The core idea is to separate the processing of shares in time in order to achieve non-completeness. Resulting circuits are proven first-order glitchextended PINI secure. This means the method can be straightforwardly applied to mask arbitrary functions without constraints which the designer must take care of. Furthermore we show that an implementation can benefit from optimization through EDA tools without sacrificing security. We provide concrete results of several case studies. Our low-latency implementation of a complete PRINCE core shows a 32% area improvement (44% with optimization) over the state-of-the-art. Our PRINCE S-Box passes formal verification with a tool and the complete core on FPGA shows no first-order leakage in TVLA with 100 million traces. Our low-latency implementation of the AES S-Box costs roughly one third (one quarter with optimization) of the area of state-of-the-art implementations. It shows no first-order leakage in TVLA with 250 million traces.
Publication
Transactions of Cryptographic Hardware and Embedded Systems, Volume 2024, Issue 3
PaperArtifact
Artifact number
tches/2024/a20
Artifact published
August 15, 2024
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License
This work is licensed under the MIT License.
BibTeX How to cite
Dilip Kumar S. V., Siemen Dhooghe, Josep Balasch, Benedikt Gierlichs, Ingrid Verbauwhede. Time Sharing - A Novel Approach to Low-Latency Masking. (2024). IACR Transactions on Cryptographic Hardware and Embedded Systems, 2024(3), 249-272. https://doi.org/10.46586/tches.v2024.i3.249-272 Artifact available at https://artifacts.iacr.org/tches/2024/a20