Transactions on Cryptographic Hardware and Embedded Systems 2025
Higher-Order Time Sharing Masking
Dilip Kumar S. V.
COSIC, KU Leuven, Belgium
Siemen Dhooghe
COSIC, KU Leuven, Belgium
Josep Balasch
e-Media Research Lab, STADIUS, KU Leuven, Belgium
Benedikt Gierlichs
COSIC, KU Leuven, Belgium
Ingrid Verbauwhede
COSIC, KU Leuven, Belgium
Keywords: Hardware, Masking, Probing Security, Side-Channel Analysis, Low-Latency
Abstract
At CHES 2024, Time Sharing Masking (TSM) was introduced as a novel low-latency masking technique for hardware circuits. TSM offers area and randomness efficiency, as well as glitch-extended PINI security, but it is limited to first-order security. We address this limitation and generalize TSM to higher-order security while maintaining all of TSM’s advantages. Additionally, we propose an area-latency tradeoff. We prove HO-TSM glitch-extended PINI security and successfully evaluate our circuits using formal verification tools. Furthermore, we demonstrate area- and latency-efficient implementations of the AES S-box, which do not exhibit leakage in TVLA on FPGA. Our proposed tradeoff enables a first-order secure implementation of a complete AES-128 encryption core with 92 kGE, 920 random bits per round, and 20 cycles of latency, which does not exhibit leakage in TVLA on FPGA.
Publication
IACR Transactions on Cryptographic Hardware and Embedded Systems, Volume 2025, Issue 2
PaperArtifact
Artifact number
tches/2025/a15
Artifact published
July 18, 2025
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✅ IACR CHES Artifacts Functional
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BibTeX How to cite
Dilip Kumar S. V., Siemen Dhooghe, Josep Balasch, Benedikt Gierlichs, Ingrid Verbauwhede. (2025). Higher-Order Time Sharing Masking. IACR Transactions on Cryptographic Hardware and Embedded Systems, 2025(2), 235–267. https://doi.org/10.46586/tches.v2025.i2.235-267. Artifact at https://artifacts.iacr.org/tches/2025/a15.