International Association for Cryptologic Research

International Association
for Cryptologic Research

Transactions on Cryptographic Hardware and Embedded Systems 2025

Higher-Order Time Sharing Masking


Dilip Kumar S. V.
COSIC, KU Leuven, Belgium

Siemen Dhooghe
COSIC, KU Leuven, Belgium

Josep Balasch
e-Media Research Lab, STADIUS, KU Leuven, Belgium

Benedikt Gierlichs
COSIC, KU Leuven, Belgium

Ingrid Verbauwhede
COSIC, KU Leuven, Belgium


Keywords: Hardware, Masking, Probing Security, Side-Channel Analysis, Low-Latency


Abstract

At CHES 2024, Time Sharing Masking (TSM) was introduced as a novel low-latency masking technique for hardware circuits. TSM offers area and randomness efficiency, as well as glitch-extended PINI security, but it is limited to first-order security. We address this limitation and generalize TSM to higher-order security while maintaining all of TSM’s advantages. Additionally, we propose an area-latency tradeoff. We prove HO-TSM glitch-extended PINI security and successfully evaluate our circuits using formal verification tools. Furthermore, we demonstrate area- and latency-efficient implementations of the AES S-box, which do not exhibit leakage in TVLA on FPGA. Our proposed tradeoff enables a first-order secure implementation of a complete AES-128 encryption core with 92 kGE, 920 random bits per round, and 20 cycles of latency, which does not exhibit leakage in TVLA on FPGA.

Publication

IACR Transactions on Cryptographic Hardware and Embedded Systems, Volume 2025, Issue 2

Paper

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Artifact number
tches/2025/a15

Artifact published
July 18, 2025

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BibTeX How to cite

Dilip Kumar S. V., Siemen Dhooghe, Josep Balasch, Benedikt Gierlichs, Ingrid Verbauwhede. (2025). Higher-Order Time Sharing Masking. IACR Transactions on Cryptographic Hardware and Embedded Systems, 2025(2), 235–267. https://doi.org/10.46586/tches.v2025.i2.235-267. Artifact at https://artifacts.iacr.org/tches/2025/a15.