Transactions on Cryptographic Hardware and Embedded Systems 2023

TCHES 2023 Artifacts

Scope and Aims

The two main goals of the TCHES 2023 artifact review process were to improve functionality and reusability of artifacts to enable reproducibility and extension by the scientific community.

Reproducibility, in the context of computational experiments, means that the scientific results claimed can be obtained by a different team using the original authors’ artifacts. The artifact review process for TCHES 2023 did not include attempting to reproduce the experiment and verify the scientific claims in the accepted paper. Rather, the artifact review process for TCHES 2023 aimed at ensuring sufficient functionality of the artifact to enable a research team to attempt to reproduce the results. The artifact review process for TCHES 2023 also aimed to improve reusability, meaning that the artifacts are not just functional, but of sufficient quality that they could be extended and reused by others.

For more information, please see the TCHES 2023 Call for Artifacts.

Volume 2023, Issue 1

A Faster Third-Order Masking of Lookup Tables
Anju Alexander, Annapurna Valiveti, and Srinivas Vivek.

MCRank: Monte Carlo Key Rank Estimation for Side-Channel Security Evaluations
Giovanni Camurati, Matteo Dell'Amico, and François-Xavier Standaert.

SoK: SCA-secure ECC in software – mission impossible?
Łukasz Chmielewski, Björn Haase, Lejla Batina, Niels Samwel, and Peter Schwabe.

Volume 2023, Issue 2

On Protecting SPHINCS+ Against Fault Attacks
Aymeric Genêt.

RDS: FPGA Routing Delay Sensors for Effective Remote Power Analysis Attacks
David Spielmann, Ognjen Glamocanin, and Mirjana Stojilovic.

A Closer Look at the Chaotic Ring Oscillators based TRNG Design
Shuqin Su, Bohan Yang, Vladimir Rožić, Mingyuan Yang, Min Zhu, Shaojun Wei, and Leibo Liu.

"Whispering MLaaS" – Exploiting Timing Channels to Compromise User Privacy in Deep Neural Networks
Shubhi Shukla, Manaar Alam, Sarani Bhattacharya, Pabitra Mitra, and Debdeep Mukhopadhyay.

TCHES 2023 Artifact Review Committee

Artifact Review Chair:

• Peter Schwabe, MPI-SP & Radboud University

Artifact Review Committee Members:

• Fabio Campos (Radboud University, NL & RheinMain University of Applied Sciences, DE)
• Łukasz Chmielewski (Masaryk University, CZ & Radboud University, NL)
• Pedro Maat Costa Massolino (PQShield, UK)
• Catherine Easdon (Dynatrace Research, USA)
• Tim Fritzmann (Infineon Technologies, DE)
• Vincent Hwang (Academia Sinica, TW)
• Ján Jančár (Masaryk University, CZ)
• Samuel Jaques (University of Oxford, UK)
• Felix Klement (University of Passau, DE)
• Markus Krauz (Ruhr University Bochum, DE)
• Norman Lahr (Fraunhofer SIT, DE)
• Eduardo Lopes Cominetti (Universidade de São Paulo, BR)
• Marco Antonio Marques (Universidade de São Paulo, BR)
• Nicolai Müller (Ruhr University Bochum, DE)
• Maximilian Orlt (Technische Universität Darmstadt, DE)
• Lorenz Panny (Academia Sinica, TW)
• Richard Petri (Fraunhofer SIT, DE)
• Prasanna Ravi (Temasek Labs & Nanyang Technological University, SG)
• Akira Takahashi (University of Edinburgh, UK)
• Alexander Treff (Universität zu Lübeck, DE)
• Monika Trimoska (Radboud University, NL)
• Julian Wälde (Fraunhofer SIT, DE)
• Yingchen Wang (University of Texas at Austin, USA)
• Zhiyuan Zhang (University of Adelaide, AU)
• Ralf Zimmermann (Zentrale Stelle für Informationstechnik im Sicherheitsbereich, DE)